Microsystem
MEMS

We offer qualified services within the development of MEMS sensors and their subsequent integration into system prototypes. Work in this area is carried out within the framework of three business models: Total Solutions, computer based input (with IPR protection) and full co-ordination from project start including close co-operation with a MEMS foundry.

In respect of design, technology and manufacturing and testing and characterisation, our experience is at your disposal.
 

To facilitate our design work, we use a number of modern software tools including ANSYS, Conventor 3D simulator, Mathematica, Labview, Cadence and Pads.

Imego’s design and simulation capability covers more than sensor components such as the Triaxial Accelerometer and Gyroscope and Microsystems like the Inertial Navigation System. It includes electronic sensor readout systems like ASICS, EPGA implementations for sensor electronics, digital electronics, advanced signal-processing algorithms designed to further improve sensor performance and software. Our team can also assist in issues relating to wafer-level or chip-level packaging.
 

In this area, we apply a wide range of standard technology as well as our own customised equipment. We also have access to outstanding facilities, such as the clean room at MC2, Chalmers University Of Technology, for example. Here, 4 and 6-inch diameter wafer processing with bulk micromachining (KOH and TMAH etc with precision mask to crystal orientation alignment, deep silicon etching plasma and wafer assembly using different bonding techniques) can take place. Other techniques we use include surface micromachining, bonding technology (anodic, direct, plasma assisted, adhesive etc for standard materials such as silicon and glass as well as others materials such as low CTE/LTCC) and bonding techniques for wafer-level and chip level (flip-chip method) packaging.
 

MEMS components and systems are tested and characterised depending on their application. As well as conventional instruments such as SMU’s, oscilloscopes and spectrum and network analysers, we utilise a semi-automatic probe station with integrated, contact-free surface profile meter and vibration amplitude meter which allows us to characterise and evaluate a sensor’s moving mechanical parts such as a micro-cantilever or resonator. Additional technology at our disposal includes a computer controlled single-axis rate table with associated two-axis positioning fixture in a temperature chamber a computer controlled vibration table with feedback enabling the recreation of recorded vibration environments and a scanning laser Doppler vibrometer for dynamic characterisation of MST structures and larger objects.