We offer qualified services within the development of MEMS sensors and
their subsequent integration into system prototypes. Work in this area is
carried out within the framework of three business models: Total
Solutions, computer based input (with IPR protection) and full
co-ordination from project start including close co-operation with a MEMS
foundry.
In respect of design, technology and manufacturing and testing and
characterisation, our experience is at your disposal.
MEMS Design
To facilitate our design work, we use a number of modern software tools
including ANSYS, Conventor 3D simulator, Mathematica, Labview, Cadence
and Pads.
Imego’s
design and simulation capability covers more than sensor components such
as the Triaxial Accelerometer and Gyroscope and Microsystems like the
Inertial Navigation System. It includes electronic sensor readout systems
like ASICS, EPGA implementations for sensor electronics, digital
electronics, advanced signal-processing algorithms designed to further
improve sensor performance and software. Our team can also assist in
issues relating to wafer-level or chip-level packaging.
Technology & Prototyping
In this area, we apply a wide range of standard technology as well as our
own customised equipment. We also have access to outstanding facilities,
such as the clean room at MC2, Chalmers University Of Technology, for
example. Here, 4 and 6-inch diameter wafer processing with bulk
micromachining (KOH and TMAH etc with precision mask to crystal
orientation alignment, deep silicon etching plasma and wafer assembly
using different bonding techniques) can take place. Other techniques we
use include surface micromachining, bonding technology (anodic, direct,
plasma assisted, adhesive etc for standard materials such as silicon and
glass as well as others materials such as low CTE/LTCC) and bonding
techniques for wafer-level and chip level (flip-chip method)
packaging.
Testing & Characterisation
MEMS components and systems are tested and characterised depending on
their application. As well as conventional instruments such as SMU’s,
oscilloscopes and spectrum and network analysers, we utilise a
semi-automatic probe station with integrated, contact-free surface
profile meter and vibration amplitude meter which allows us to
characterise and evaluate a sensor’s moving mechanical parts such as a
micro-cantilever or resonator. Additional technology at our disposal
includes a computer controlled single-axis rate table with associated
two-axis positioning fixture in a temperature chamber a computer
controlled vibration table with feedback enabling the recreation of
recorded vibration environments and a scanning laser Doppler vibrometer
for dynamic characterisation of MST structures and larger objects.