Bonding method and product (Elnät under glas)
Germany, France, Great Britain, Sweden (1436237; 0102476-9)
Inventors: Leif Bergstedt, Katrin Persson
Abstract
This invention concerns a method of anodic bonding a structure (14) to a glass layer (12). The method consists of arranging a conductive pattern (11) on a substrate, providing the glass layer on the conductive pattern (11), placing the structure on the glass layer (12), placing an electrode on one side of the structure, and applying a voltage to the conductive pattern and electrode to obtain an electrical field across the structure and the glass layer between the conductive pattern (11) and the electrode (15) to produce anodic bonding between the structure and the glass layer.
Development at IMEGO
The invention proposes a packaging method where anodic bonding is produced between silicon-like material (14) and ceramic-like material (10) via an intermediate glass-like layer (12). The conductive layer (11) is patterned onto one of the bonding members. This allows for lower voltage during the anodic bonding process that makes it possible to package sensitive structures on the bonding member.
