Method relating to anodic bonding (Screentryck)
Europe, Japan, Sweden, USA (1234330; 2003-512723; 522141; 6,951,797)
Inventors: Leif Bergstedt, Gert Andersson, Britta Ottosson
Abstract
A member (M1) (210) is bonded with a silicon member (220) by means of anodic bonding by selectively depositing at least one bondable section (270) on the member (M1) before contacting the member (M1) and the silicon member together for anodic bonding. The selective deposition is provided with screen printing or photoimage formation. Independent claims are also included for the following: (a) Sensor; (b) Biological circuit
Development at IMEGO
For packaging applications, we have developed a method to bond a ceramic-like wafer (eg LTCC) (210) to a silicon wafer (220) anodically by using a glass-like intermediate layer (270, 280?). This method can be used for any silicon-based device for consumer applications (not high-performance markets).
