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The RGDT – Integration of Micromechanics and Electronics by Plasma Assisted Wafer Bonding
Anke Sanz-Velasco
Technical Report no. 417, Department of Microelectronics E, Solid State Electronics Laboratory, Chalmers University of Technology, Sweden, 2002
Micromachined Three-Axis Accelerometers and Sensors Readout Electronics
Henrik rödjegård
Technical report no. MC2-18, Department of Microelectronics E, Solid State Electronics Laboratory, Chalmers University of Technology, Sweden, 2005
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